Thermal conductivity and interfacial energies of solid Sn solution in the Sn-Ag-In ternary alloy

Ocak Y., Aksöz S., MARAŞLI N., Keşlioǧlu K.

Chemical Physics Letters, cilt.496, sa.4-6, ss.263-269, 2010 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 496 Sayı: 4-6
  • Basım Tarihi: 2010
  • Doi Numarası: 10.1016/j.cplett.2010.07.049
  • Dergi Adı: Chemical Physics Letters
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.263-269
  • İstanbul Gelişim Üniversitesi Adresli: Hayır

Özet

The equilibrated grain boundary groove shapes of solid Sn solution in equilibrium with the Sn-Ag-In liquid have been observed from quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn solution have been determined. The thermal conductivity values for solid Sn solution (Sn-2.1 at.%In) and eutectic solid (Sn-4.4 at.%Ag-2.1 at.%In) and the thermal conductivity ratio of eutectic liquid phase to eutectic solid for Sn-4.4 at.%Ag-2.1 at.%In alloy at the melting temperature have also been measured with a radial heat flow apparatus and Bridgman type growth apparatus, respectively. © 2010 Elsevier B.V. All rights reserved.