Effects of Minor Al, Ag, and Sb Additions on the Thermal, Microstructure and Microhardness of Zn–Sn–Cu–Bi High-Temperature Solder Alloys

Sezen Aksöz A., Esener P. A., ÖZTÜRK E., MARAŞLI N.

Protection of Metals and Physical Chemistry of Surfaces, vol.60, no.4, pp.723-733, 2024 (SCI-Expanded) identifier

  • Publication Type: Article / Article
  • Volume: 60 Issue: 4
  • Publication Date: 2024
  • Doi Number: 10.1134/s2070205124701934
  • Journal Name: Protection of Metals and Physical Chemistry of Surfaces
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Chemical Abstracts Core, Compendex, INSPEC, Metadex
  • Page Numbers: pp.723-733
  • Keywords: high-temperature solder alloys, microhardness, microstructure, thermal conductivity
  • Istanbul Gelisim University Affiliated: Yes

Abstract

Abstract: In the present study, the changes in microstructure, thermal conductivity (K), melting properties and microhardness (HV) adding of 0.05 wt % Al, Ag and Sb into Zn–5Sn–2Cu–1.5Bi (ZSCB) high temperature solder alloy were investigated. The addition of trace amounts of Al, Ag and Sb caused a significant improvement in K and HV values. Addition of 0.05 wt % of Al and Ag into the ZSCB alloy increased the K and HV values by 62% and in the range of 19–21%, respectively. The addition of 0.05 wt % of Sb increased the K and HV values by 32 and 36%, respectively.