Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys

Sezen Aksöz A., Öcal F., Esener P. A., Öztürk E., Maraşlı N.

Physics of Metals and Metallography, cilt.124, sa.13, ss.1547-1554, 2023 (SCI-Expanded) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 124 Sayı: 13
  • Basım Tarihi: 2023
  • Doi Numarası: 10.1134/s0031918x22601974
  • Dergi Adı: Physics of Metals and Metallography
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Compendex, INSPEC, Metadex
  • Sayfa Sayıları: ss.1547-1554
  • Anahtar Kelimeler: electrical conductivity, microhardness, microstructure, SAC105 solder alloys, thermal conductivity
  • İstanbul Gelişim Üniversitesi Adresli: Evet

Özet

Abstract: In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn–1 wt % Ag–0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb caused a significant improvement in microhardness while decreasing the melting temperature range, thermal conductivity and electrical conductivity. Addition of 0.5, 1, 1.5 wt % Sb to SAC105 alloy system decreased the thermal conductivity by 48% and electrical conductivity by 27%. The addition of Sb at the same rate increased the microhardness by 27%.