Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys

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Sezen Aksöz A., Öcal F., Esener P. A., Öztürk E., Maraşlı N.

Physics of Metals and Metallography, vol.124, no.13, pp.1547-1554, 2023 (SCI-Expanded)

• Publication Type: Article / Article
• Volume: 124 Issue: 13
• Publication Date: 2023
• Doi Number: 10.1134/s0031918x22601974
• Journal Name: Physics of Metals and Metallography
• Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Compendex, INSPEC, Metadex
• Page Numbers: pp.1547-1554
• Keywords: electrical conductivity, microhardness, microstructure, SAC105 solder alloys, thermal conductivity
• Istanbul Gelisim University Affiliated: Yes

Abstract

Abstract: In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn–1 wt % Ag–0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb caused a significant improvement in microhardness while decreasing the melting temperature range, thermal conductivity and electrical conductivity. Addition of 0.5, 1, 1.5 wt % Sb to SAC105 alloy system decreased the thermal conductivity by 48% and electrical conductivity by 27%. The addition of Sb at the same rate increased the microhardness by 27%.