Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys
Physics of Metals and Metallography, cilt.124, sa.13, ss.1547-1554, 2023 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 124 Sayı: 13
- Basım Tarihi: 2023
- Doi Numarası: 10.1134/s0031918x22601974
- Dergi Adı: Physics of Metals and Metallography
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Compendex, INSPEC, Metadex
- Sayfa Sayıları: ss.1547-1554
- Anahtar Kelimeler: electrical conductivity, microhardness, microstructure, SAC105 solder alloys, thermal conductivity
- İstanbul Gelişim Üniversitesi Adresli: Evet
Özet
Abstract: In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn–1 wt % Ag–0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb caused a significant improvement in microhardness while decreasing the melting temperature range, thermal conductivity and electrical conductivity. Addition of 0.5, 1, 1.5 wt % Sb to SAC105 alloy system decreased the thermal conductivity by 48% and electrical conductivity by 27%. The addition of Sb at the same rate increased the microhardness by 27%.