Determination of thermal conductivity and interfacial energy of solid Zn solution in the Zn-Al-Bi eutectic system

Aksöz S., Ocak Y., MARAŞLI N., Keşlioǧlu K.

Experimental Thermal and Fluid Science, vol.35, no.2, pp.395-404, 2011 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 35 Issue: 2
  • Publication Date: 2011
  • Doi Number: 10.1016/j.expthermflusci.2010.11.001
  • Journal Name: Experimental Thermal and Fluid Science
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.395-404
  • Keywords: Crystal growth, Surface energy, Solid-liquid interface energy, Thermal conductivity, Solidification, Metals and alloys
  • Istanbul Gelisim University Affiliated: No

Abstract

The equilibrated grain boundary groove shapes for solid Zn solution (Zn-3.0 at.% Al-0.3 at.% Bi) in equilibrium with the Zn-Al-Bi eutectic liquid (Zn-12.7 at.% Al-1.6 at.% Bi) have been observed from quenched sample with a radial heat flow apparatus. Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy for solid Zn solution in equilibrium with Al-Bi-Zn eutectic liquid have been determined to be (5.1±0.4)×10-8Km, (80.1±9.6)×10-3 and (158.6±20.6)×10-3Jm-2 from the observed grain boundary groove shapes, respectively. The thermal conductivity variation with temperature for solid Zn solution has been measure with radial heat flow apparatus and the value of thermal conductivity for solid Zn solution has been determined to be 135.68W/km at the eutectic melting temperature. The thermal conductivity ratio of equilibrated eutectic liquid to solid Zn solution, R=KL(Zn)/KS(Zn) has also been measured to be 0.85 with Bridgman type solidification apparatus. © 2010 Elsevier Inc.