Research Information System
International Journal of Thermophysics, vol.42, no.6, 2021 (SCI-Expanded)
Directional solidification of Al–Cu–Ti (Al–33wt%Cu–0.1wt%Ti) eutectic alloy was done with a growth rate range (V = 8.58 to 2038.65 µm⋅s−1) at a temperature gradient of 6.45 K⋅mm−1 using Bridgman-type directional solidification furnace. The measurements of thermal conductivity (K) and electrical resistivity (ρ) for the Al–Cu–Ti alloy solidified with the different values of V were made by the longitudinal heat flow method (LHFM) and DC four-point probe technique (FPPT). While the highest values of K and ρ were determined to be 236.04 W⋅K–1⋅m–1 and 5.91 × 10−8 Ωm, respectively, at 8.58 μm⋅s–1, the lowest values of K and ρ were obtained to be 199.82 W⋅K–1⋅m–1 and 12.11 × 10−8 Ωm, respectively, at 2038.65 μm⋅s–1. The K and ρ dependences on V were obtained to be K=259.96×V-0.032 and ρ=4.47×10-8V0.13 from linear regression analysis. The fusion enthalpy (∆H) and specific heat difference between solid and liquid (∆CP) for the Al–Cu–Ti were also determined to be 222.69 J⋅g–1 and 0.266 Jg–1⋅K–1, respectively, by means of differential scanning calorimetry (DSC).