Directionally Solidified Al–Cu–Si–Fe Quaternary Eutectic Alloys

BÜYÜK U., Engin S., KAYA H., Çadırlı E., MARAŞLI N.

Physics of Metals and Metallography, cilt.121, sa.1, ss.78-83, 2020 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 121 Sayı: 1
  • Basım Tarihi: 2020
  • Doi Numarası: 10.1134/s0031918x20010044
  • Dergi Adı: Physics of Metals and Metallography
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Compendex, INSPEC, Metadex
  • Sayfa Sayıları: ss.78-83
  • Anahtar Kelimeler: quaternary Al-based alloy, microstructure, tensile strength, microhardness, electrical resistivity
  • İstanbul Gelişim Üniversitesi Adresli: Hayır

Özet

Abstract—: Directional solidification of eutectic alloys attracts considerable attention because of microhardness, tensile strength, and electrical resistivity affected by eutectic structures. In this research, solidification processing of Al–Cu–Si–Fe (Al–26 wt % Cu–6.5 wt % Si–0.5 wt % Fe) quaternary eutectic alloy by directional solidification is examined. The alloy was prepared by vacuum furnace and directionally solidified in Bridgman-type equipment. During the directional solidification process, the growth rates utilized varied from 8.25 to 164.80 μm/s. The Al–Cu–Si–Fe system showed a eutectic transformation, which resulted in the matrix Al, lamellar Al2Cu, plate Si, and plate Al7Cu2Fe phases. The eutectic spacing λAl2Cu between lamellae of Al2Cu, as well as—λSi, between plates of Si phase,—was measured. Additionally, the microhardness, tensile strength, and electrical resistivity of the studied alloy were determined using directionally solidified samples, and the experimental relationships between them were obtained. It was found that the microhardness, tensile strength, and electrical resistivity were affected by both eutectic spacing and the growth rate.