Thermal conductivity and electrical resistivity dependences on growth rate in the directionally solidified Al–Cu–Ni eutectic alloy

BAYRAM Ü., MARAŞLI N.

Journal of Alloys and Compounds, cilt.753, ss.695-702, 2018 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 753
  • Basım Tarihi: 2018
  • Doi Numarası: 10.1016/j.jallcom.2018.04.277
  • Dergi Adı: Journal of Alloys and Compounds
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.695-702
  • Anahtar Kelimeler: Directional solidification, Aluminum alloys, Microstructure, Thermal conductivity, Electrical resistivity
  • İstanbul Gelişim Üniversitesi Adresli: Hayır

Özet

The thermal conductivity and electrical resistivity dependences on growth rate in the directionally solidified Al-Cu-.Ni eutectic alloy (Al-32.5 wt%Cu-%1 wt.Ni) were investigated. For this purpose, the Al-Cu-.Ni eutectic alloy was solidified at a constant temperature gradient of 4.93 K mm−1 with different growth rates, V = 9.25–2056.68 μm s−1 by a Bridgman type directional solidification furnace. The thermal conductivity (K) and electrical resistivity (ρ) of the Al-Cu-Ni alloy solidified with different growth rates were measured with the longitudinal heat flow method and DC four−point probe technique at room temperature. The dependences of K and ρ on V for directionally solidified Al-Cu-Ni eutectic alloy were experimentally obtained by linear regression analysis. Finally, the specific heat difference between solid and liquid phases (ΔCP) and enthalpy of fusion (ΔH) for Al-32.5 wt%Cu-%1 wt.Ni alloy were determined by means of differential scanning calorimetry (DSC) at its melting temperature.