Akademik Veri Yönetim Sistemi
Journal of Materials Science: Materials in Electronics, cilt.30, sa.4, ss.3678-3691, 2019 (SCI-Expanded)
The thermal conductivity variations with temperature for Zn 90 − x –Sn x –Bi10 (x = 5,10, 40 and 85 wt%) and Bi 88 − x –Sn x –Zn 12 (x = 1.39, 43.26 and 79.3 wt%) alloys were measured by using the linear heat flow method. From thermal conductivity–temperature plots, the coefficients of thermal conductivity for the Zn–Sn–Bi alloys were calculated. The microstructures of Zn–Sn–Bi alloys were observed using scanning electron microscopy (SEM). The existing phases into microstructure were identified energy dispersive X-ray (EDX) analysis. The melting temperatures, the enthalpy of fusion and specific heat change between the liquid and solid phases in the Zn–Sn–Bi alloys were determined from Differential Scanning Calorimetry (DSC) trace. The tensile strength and microhardness of the alloys were measured using a Shimadzu Universal Testing Instrument (Type AG-10 KNG) and Future-Tech FM-700 model microhardness device.