Research Information System
Current Applied Physics, vol.12, no.1, pp.7-10, 2012 (SCI-Expanded, Scopus)
Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 μm/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a constant growth rate (8.30 μm/s) by using a Bridgman type directional solidification apparatus. The dependence of microhardness (HV) on the growth rate (V), temperature gradient (G) and microstructure parameter (λ) were found to be HV = k1 V0.10, HV = k2 G0.13 and HV = k3 λ-0.22, respectively. The electrical resistivity of the Al-Cu-Ag eutectic cast alloy increases linearly with the temperature in the range of 300-780 K. The enthalpy of fusion and specific heat change during melting for same alloy were also determined to be 223.8 J/g, and 0.433 J/g K, respectively by a differential scanning calorimeter from heating curve during the transformation from eutectic solid to eutectic liquid. © 2011 Elsevier B.V. All rights reserved.