Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder

Çadlrll E., Böyük U., KAYA H., MARAŞLI N.

Metals and Materials International, cilt.18, sa.2, ss.349-354, 2012 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 18 Sayı: 2
  • Basım Tarihi: 2012
  • Doi Numarası: 10.1007/s12540-012-2021-7
  • Dergi Adı: Metals and Materials International
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.349-354
  • Anahtar Kelimeler: alloys, solidification, microstructure, soldering, crystal growth
  • İstanbul Gelişim Üniversitesi Adresli: Hayır

Özet

Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 μm/s) and at a constant growth rate (V=8.3 μm/s) with a wide range of temperature gradients (1.78-3.99 K/mm) using a Bridgman type directional solidification furnace. Wavelength-Dispersive X-ray Fluorescence spectrometry and X-ray diffraction were used to identify the compositions and phases in the microstructure. Dependence of eutectic spacings (λ) on the growth rate (V), temperature gradient (G) and cooling rate () were determined using linear regression analysis. From the experimental results, it can be concluded that the values of λ decrease with the increasing the values of V, G and. The value of λ2V was determined using the measured values of λ and V. The results obtained in the present work have been compared with previous results obtained for binary or ternary alloys. © KIM and Springer.