The effect of condenser and evaporator section lengths on the thermal performance of a nano-flat plate heat pipe: molecular dynamics simulation
International Communications in Heat and Mass Transfer, cilt.180, 2026 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 180
- Basım Tarihi: 2026
- Doi Numarası: 10.1016/j.icheatmasstransfer.2026.112702
- Dergi Adı: International Communications in Heat and Mass Transfer
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Compendex, INSPEC, Academic Search Ultimate (EBSCO), Engineering Source (EBSCO)
- Anahtar Kelimeler: Concentrator photovoltaic (CPV), Heat transfer, Molecular dynamics, Nano-heat pipe, Superconductor
- İstanbul Gelişim Üniversitesi Adresli: Evet
Özet
Nano-heat pipes (NHPs), as reliable superconductors, play a crucial role in the thermal management of some high-tech devices. Among them, concentrator photovoltaic (CPV) panels and microprocessors rely more on sustainable thermal management. Understanding their function requires further molecular-level studies. This paper evaluates the mass and thermal performance of a flat-plate NHP with rectangular nanogrooves. Given the problem scale, we used molecular dynamics (MD) simulations. In particular, the influences of the condenser and evaporator lengths are investigated. For the length of each part, five modes and a total of 25 modes are defined. Mass transfer rates, condensation rates, and evaporation rates were obtained for each state, and the resulting relationships were also determined. The impact of length on the heat transfer rate was also fully evaluated. The distributions of velocity and temperature within the heat pipe (HP) were also presented and analyzed graphically. The results show that, in general, increasing the condenser and evaporator lengths improves HP performance. Increasing the condenser and evaporator lengths (from 5% to 25% of the total HP length) increases the evaporation and condensation rates by 31% and 43.4%, respectively. Moreover, the heat flux increases to 1688 W/cm2. In these cases, heat is transferred through the HP in lower temperature differences.