Akademik Veri Yönetim Sistemi
Physics of Metals and Metallography, cilt.118, sa.4, ss.389-398, 2017 (SCI-Expanded)
The composition of an Al–Cu–Mg ternary eutectic alloy was chosen to be Al–30 wt% Cu–6 wt % Mg to have the Al2Cu and Al2CuMg solid phases within an aluminum matrix (α-Al) after its solidification from the melt. The alloy Al–30 wt % Cu–6 wt % Mg was directionally solidified at a constant temperature gradient (G = 8.55 K/mm) with different growth rates V, from 9.43 to 173.3 μm/s, by using a Bridgman-type furnace. The lamellar eutectic spacings (λE) were measured from transverse sections of the samples. The functional dependencies of lamellar spacings λE (λAl2CuMg and λAl2Cu in μm), microhardness HV (in kg/mm2), tensile strength σT (in MPa), and electrical resistivity ρ (in Ω m) on the growth rate V (in μm/s) were obtained as λAl2CuMg=3.05V−0.31, λAl2Cu=6.35V−0.35, HV= 308.3 (V) − 0.33; σT= 408.6(V)0.14, and ρ = 28.82 × 10–8(V)0.11, respectively for the Al–Cu–Mg eutectic alloy. The bulk growth rates were determined as λAl2CuMg2V=93.2 and λAl2Cu2V=195.76 by using the measured values of λAl2CuMg, λAl2Cu and V. A comparison of present results was also made with the previous similar experimental results.