Mechanical characteristics of friction-welded copper-silver junction with iron tip via molecular dynamics simulation: influence of initial temperature
Scientific Reports, cilt.16, sa.1, 2026 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 16 Sayı: 1
- Basım Tarihi: 2026
- Doi Numarası: 10.1038/s41598-026-70231-z
- Dergi Adı: Scientific Reports
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, BIOSIS, Chemical Abstracts Core, EMBASE, MEDLINE, Directory of Open Access Journals, Zoological Record, Academic Search Ultimate (EBSCO), Natural Science Collection (ProQuest), Biological Science Database (ProQuest), Biomedical Reference Collection: Corporate Edition (EBSCO), Health Research Premium Collection (ProQuest)
- Anahtar Kelimeler: Friction-welding-inspired loading, Interfacial mechanical response, Molecular dynamics simulation, Nanostructure, Process Innovation
- Açık Arşiv Koleksiyonu: AVESİS Açık Erişim Koleksiyonu
- İstanbul Gelişim Üniversitesi Adresli: Evet
Özet
This study employed molecular dynamics simulations to investigate the atomistic response of a copper–silver interface under simplified friction-welding-inspired loading. The mechanical response of the tool-modified copper–silver interface was analyzed, focusing on the influence of the initial temperature (300–400 K). The research methodology was divided into two phases: first, the physical stability of modeled samples was assessed at an initial temperature of 300 K by monitoring key physical parameters, such as kinetic and total energy. Subsequently, simplified friction-welding-inspired loading was applied to the equilibrated sample, followed by mechanical deformation to evaluate the resulting interfacial response. This approach enabled a detailed analysis of temperature-dependent mechanical characteristics, including stress–strain behavior, radial distribution function, interaction energy, mean square displacement, ultimate strength, and Young's modulus. Results show that increasing temperature increases thermal energy, weakening the interatomic bonds between copper and silver atoms and thereby reducing the ultimate strength and stiffness of the tool-modified interface. Specifically, the ultimate strength decreased from 1490.27 MPa to 1348.88 MPa as the temperature increased from 300 to 400 K, while Young's modulus decreased correspondingly. This study provides atomistic insights into how initial temperature affects the mechanical response of a copper–silver interface under simplified friction-welding-inspired conditions.