Effect of silicon nanoparticles on the structural and thermal performance of a microscale heat exchanger: A molecular dynamics study
Case Studies in Chemical and Environmental Engineering, cilt.14, 2026 (Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 14
- Basım Tarihi: 2026
- Doi Numarası: 10.1016/j.cscee.2026.101501
- Dergi Adı: Case Studies in Chemical and Environmental Engineering
- Derginin Tarandığı İndeksler: Scopus
- Anahtar Kelimeler: Energy efficiency, Heat exchanger, Molecular dynamics simulation, Silicon nanoparticle, Thermal performance
- İstanbul Gelişim Üniversitesi Adresli: Evet
Özet
This study examined how silicon substitution in the copper walls of a sinusoidal microchannel affects its calculated thermal and fluid transport properties. Molecular dynamics simulations were performed in LAMMPS for Si atomic concentrations of 5%, 7.5%, 10%, and 15% in a channel containing a water–graphene system. After equilibration, we evaluated heat flux, thermal conductivity, viscosity, near-wall fluid stabilization time, and the friction coefficient. Heat flux increased from 46.16 W/m2 at 5% Si to a maximum of 48.95 W/m2 at 10% Si, then decreased slightly to 48.67 W/m2 at 15% Si. Thermal conductivity followed the same trend, rising from 15.39 to 15.67 W m−1 K−1 between 5% and 10% Si before declining to 15.51 W m−1 K−1 at 15% Si. Across the investigated range, the reported viscosity decreased from 0.28 to 0.20 mPa s, near-wall fluid stabilization time decreased from 3.11 to 2.92 ns, and the coefficient of friction decreased from 0.019 to 0.013. Thus, 10% Si produced the highest calculated heat flux and thermal conductivity, whereas 15% Si produced the lowest reported viscosity, stabilization time, and coefficient of friction.