The Measurement of Thermal Conductivity Variation with Temperature for Sn-Based Lead-Free Binary Solders
Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science, cilt.45, sa.5, ss.1739-1749, 2014 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 45 Sayı: 5
- Basım Tarihi: 2014
- Doi Numarası: 10.1007/s11663-014-0109-9
- Dergi Adı: Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
- Sayfa Sayıları: ss.1739-1749
- İstanbul Gelişim Üniversitesi Adresli: Hayır
Özet
The variations of thermal conductivity with temperature in the Sn-based lead-free binary solders, Sn-10 wt pct X (X = Ag, In, Bi, Cu, Sb, Zn), were measured by using the linear heat flow apparatus. The thermal conductivities of Sn-based lead-free solders at their melting temperature were obtained from graphs of thermal conductivity variation with temperature. The variations of electrical conductivity with temperature for same solders were also determined from the Wiedemann–Franz (W–F) equation by using the measured values of thermal conductivity.