Determination of interfacial energies for solid al solution in equilibrium with Al-Cu-Ag liquid

Keşlioğlu K., Ocak Y., Aksöz S., MARAŞLI N., Çadlrll E., KAYA H.

Metals and Materials International, cilt.16, sa.1, ss.51-59, 2010 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 16 Sayı: 1
  • Basım Tarihi: 2010
  • Doi Numarası: 10.1007/s12540-010-0051-6
  • Dergi Adı: Metals and Materials International
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.51-59
  • Anahtar Kelimeler: alloys, crystal growth, interfaces, grain boundary, thermal conductivity
  • İstanbul Gelişim Üniversitesi Adresli: Hayır

Özet

The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy, and grain boundary energy of the solid Al solution were determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase for Al-16.42 at.% Ag-4.97 at.% Cu and Al-16.57 at.% Ag-11.87 at.% Cu alloys and the thermal conductivity ratio of the liquid phase to the solid phase for Al-16.57 at.% Ag-11.87 at.% Cu alloy at the melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively. © KIM and Springer.