Determination of interfacial energies for solid al solution in equilibrium with Al-Cu-Ag liquid

Keşlioğlu K., Ocak Y., Aksöz S., MARAŞLI N., Çadlrll E., KAYA H.

Metals and Materials International, vol.16, no.1, pp.51-59, 2010 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 16 Issue: 1
  • Publication Date: 2010
  • Doi Number: 10.1007/s12540-010-0051-6
  • Journal Name: Metals and Materials International
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.51-59
  • Keywords: alloys, crystal growth, interfaces, grain boundary, thermal conductivity
  • Istanbul Gelisim University Affiliated: No


The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy, and grain boundary energy of the solid Al solution were determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase for Al-16.42 at.% Ag-4.97 at.% Cu and Al-16.57 at.% Ag-11.87 at.% Cu alloys and the thermal conductivity ratio of the liquid phase to the solid phase for Al-16.57 at.% Ag-11.87 at.% Cu alloy at the melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively. © KIM and Springer.