Experimental measurements of some thermophysical properties of solid CdSb intermetallic in the Sn–Cd–Sb ternary alloy

ÖZTÜRK E., Aksöz S., ALTINTAS Y., Keşlioğlu K., MARAŞLI N.

Journal of Thermal Analysis and Calorimetry, vol.126, no.3, pp.1059-1065, 2016 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 126 Issue: 3
  • Publication Date: 2016
  • Doi Number: 10.1007/s10973-016-5626-0
  • Journal Name: Journal of Thermal Analysis and Calorimetry
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.1059-1065
  • Keywords: Alloys, Intermetallics, Interfaces, Thermal conductivity, Thermal analysis
  • Istanbul Gelisim University Affiliated: No

Abstract

The equilibrated grain boundary groove shapes of solid CdSb in equilibrium with Sn–Cd–Sb eutectic liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs–Thomson coefficient, solid–liquid interfacial energy and grain boundary energy of the solid CdSb intermetallic were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid and the thermal conductivity ratio of eutectic liquid to the eutectic solid in the Sn–35.8 at.%Cd–6.71 at.%Sb eutectic alloy at its eutectic melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.