Experimental measurements of some thermophysical properties of solid CdSb intermetallic in the Sn–Cd–Sb ternary alloy

ÖZTÜRK E., Aksöz S., ALTINTAS Y., Keşlioğlu K., MARAŞLI N.

Journal of Thermal Analysis and Calorimetry, cilt.126, sa.3, ss.1059-1065, 2016 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 126 Sayı: 3
  • Basım Tarihi: 2016
  • Doi Numarası: 10.1007/s10973-016-5626-0
  • Dergi Adı: Journal of Thermal Analysis and Calorimetry
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.1059-1065
  • Anahtar Kelimeler: Alloys, Intermetallics, Interfaces, Thermal conductivity, Thermal analysis
  • İstanbul Gelişim Üniversitesi Adresli: Hayır

Özet

The equilibrated grain boundary groove shapes of solid CdSb in equilibrium with Sn–Cd–Sb eutectic liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs–Thomson coefficient, solid–liquid interfacial energy and grain boundary energy of the solid CdSb intermetallic were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid and the thermal conductivity ratio of eutectic liquid to the eutectic solid in the Sn–35.8 at.%Cd–6.71 at.%Sb eutectic alloy at its eutectic melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.