The variations of electrical resistivity and thermal conductivity with growth rate for the Zn–Al–Cu eutectic alloy

Maraşlı N., Bayram Ü., Aksöz S.

Journal of Materials Science: Materials in Electronics, cilt.32, sa.13, ss.18212-18223, 2021 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 32 Sayı: 13
  • Basım Tarihi: 2021
  • Doi Numarası: 10.1007/s10854-021-06363-x
  • Dergi Adı: Journal of Materials Science: Materials in Electronics
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Applied Science & Technology Source, Chemical Abstracts Core, Communication Abstracts, Compendex, Computer & Applied Sciences, INSPEC, Metadex, Civil Engineering Abstracts
  • Sayfa Sayıları: ss.18212-18223
  • İstanbul Gelişim Üniversitesi Adresli: Hayır

Özet

The Zn–Al–Cu alloy (Zn–5wt%Al–0.5wt%Cu) is solidified with different growth rates (V = 8.45–2087.15 µm s−1) at a constant temperature gradient (G = 3.67 K mm−1) using Bridgman-type directional solidification apparatus (BTDSA). The thermal conductivity (K) and electrical resistivity (ρ) for the Zn–Al–Cu alloy solidified with the different V values are measured by the longitudinal heat flow method (LHFM) and DC four-point probe technique (FPPT), respectively. The λ and K decrease with the increasing V, while the ρ increases with increasing V in the Zn–Al–Cu eutectic alloy. The dependences of ρ and K on λ and V for the Zn–Al–Cu eutectic alloy are obtained as ρ= 9.98 × 10 - 8λ- 0.18, ρ=7.03×10-8V0.07, K= 110.91 λ0.104 and K=144.59V-0.040, respectively. The melting enthalpy (ΔHf) and specific heat difference between solid and liquid phases (ΔCp) for the Zn–Al–Cu eutectic alloy are determined as 113.89 J g−1 and 0.172 J g−1 K−1, respectively, by the differential scanning calorimetry (DSC).