Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy

Kaygisiz Y., Ocak Y., Aksöz S., MARAŞLI N., Keşlioǧlu K., Çadirli E., ...Daha Fazla

Chemical Physics Letters, cilt.484, sa.4-6, ss.219-224, 2010 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 484 Sayı: 4-6
  • Basım Tarihi: 2010
  • Doi Numarası: 10.1016/j.cplett.2009.11.043
  • Dergi Adı: Chemical Physics Letters
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.219-224
  • İstanbul Gelişim Üniversitesi Adresli: Hayır

Özet

The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 ± 0.6) × 10-8 Km, (113.1 ± 13.6) × 10-3 J m-2 and (222.4 ± 28.9) × 10-3 J m-2, respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. © 2009 Elsevier B.V. All rights reserved.