Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy


Kaygisiz Y., Ocak Y., Aksöz S., MARAŞLI N., Keşlioǧlu K., Çadirli E., ...More

Chemical Physics Letters, vol.484, no.4-6, pp.219-224, 2010 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 484 Issue: 4-6
  • Publication Date: 2010
  • Doi Number: 10.1016/j.cplett.2009.11.043
  • Journal Name: Chemical Physics Letters
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.219-224
  • Istanbul Gelisim University Affiliated: No

Abstract

The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 ± 0.6) × 10-8 Km, (113.1 ± 13.6) × 10-3 J m-2 and (222.4 ± 28.9) × 10-3 J m-2, respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. © 2009 Elsevier B.V. All rights reserved.